JPH0642363Y2 - 薄膜回路基板 - Google Patents

薄膜回路基板

Info

Publication number
JPH0642363Y2
JPH0642363Y2 JP15044089U JP15044089U JPH0642363Y2 JP H0642363 Y2 JPH0642363 Y2 JP H0642363Y2 JP 15044089 U JP15044089 U JP 15044089U JP 15044089 U JP15044089 U JP 15044089U JP H0642363 Y2 JPH0642363 Y2 JP H0642363Y2
Authority
JP
Japan
Prior art keywords
thin film
circuit board
film circuit
film
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15044089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0388371U (en]
Inventor
康秀 黒田
利夫 熊井
健一郎 坪根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15044089U priority Critical patent/JPH0642363Y2/ja
Publication of JPH0388371U publication Critical patent/JPH0388371U/ja
Application granted granted Critical
Publication of JPH0642363Y2 publication Critical patent/JPH0642363Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP15044089U 1989-12-26 1989-12-26 薄膜回路基板 Expired - Lifetime JPH0642363Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15044089U JPH0642363Y2 (ja) 1989-12-26 1989-12-26 薄膜回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15044089U JPH0642363Y2 (ja) 1989-12-26 1989-12-26 薄膜回路基板

Publications (2)

Publication Number Publication Date
JPH0388371U JPH0388371U (en]) 1991-09-10
JPH0642363Y2 true JPH0642363Y2 (ja) 1994-11-02

Family

ID=31696787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15044089U Expired - Lifetime JPH0642363Y2 (ja) 1989-12-26 1989-12-26 薄膜回路基板

Country Status (1)

Country Link
JP (1) JPH0642363Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102553123B1 (ko) * 2022-09-08 2023-07-11 주식회사 에이플렉스 칩의 손상이 방지된 연성인쇄회로기판

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4966810B2 (ja) * 2007-07-13 2012-07-04 シャープ株式会社 素子搭載基板、電子部品、発光装置、液晶バックライト装置、電子部品の実装方法
JP2019145546A (ja) * 2018-02-16 2019-08-29 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102553123B1 (ko) * 2022-09-08 2023-07-11 주식회사 에이플렉스 칩의 손상이 방지된 연성인쇄회로기판

Also Published As

Publication number Publication date
JPH0388371U (en]) 1991-09-10

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